BONDING METHOD USING ADHESIVE FILM AND ULTRASONIC WAVE

摘要

PURPOSE: A bonding method using adhesive film and ultrasonic wave is provided that the adhesive film is selectively fused, while the first, second attached member and the outer shape and quality of are not diversified, and the adhesive force between the first and the second attached member are improved. CONSTITUTION: A bonding method using adhesive film and ultrasonic wave comprises the following steps. A adhesive film(20) is touched with a first attached member(10). A second attached member(40) is touched with the adhesive film contacting the first attached member. The adhesive film is fused an ultrasonic wave generator is used, or it hardens. The first and the second attached member are welded.