SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package and its manufacturing method.

SOLUTION: A package element has a first insulation layer and a plurality of holes are located on a first surface of the first insulation layer. In addition, a plurality of package traces are embedded in the insulation layer to be connected to one ends of the holes. The holes provide a positioning function for connecting solder balls to the package traces, and a signal of a semiconductor chip is connected to the package traces via a conductor of the chip and the signal is transmitted to a further outside via the solder balls. The elastic modulus of a material forming the first insulation layer is preferably larger than 1.0 GPa.

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