| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition excellent in terms of resolution, adhesion and adhesive strength while it has a adequately reduced moisture permeability and moisture absorbing property and to provide a photosensitive element using the same and a resist pattern formation method and a method for adhesion of a material to be adhered. <P>SOLUTION: A photosensitive resin composition includes (A) polyamide expressed by the following general formula (1), (B) a photopolymerizable compound having ethylenic unsaturated groups other than the polyamide, (C) a photopolymerization initiator and (D) an epoxy resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
