TRANSPARENT FLEXIBLE PRINTED WIRING BOARD AND PROCESS FOR PRODUCING SAME

摘要

Provided is a transparent flexible printed wiring board which includes a transparent film and a transparent electroconductive film and which has excellent adhesion between the films and excellent flexibility and heat resistance. A transparent polyimide film (1) having a dimensional change through a burning step of within ±0.2% is prepared. The transparent polyimide film (1) is printed with an ITO ink containing fine ITO particles and a binder by ink-jet printing in a given pattern arrangement. Thereafter, this ITO ink is burned at 230-300ºC to thereby form a transparent electroconductive film (2) having a binder content of 5-10 wt.%.