ELECTRONIC COMPONENT, BOARD, AND ELECTRONIC COMPONENT MOUNTING BOARD FOR Bi-BASED SOLDER BONDING

摘要

PROBLEM TO BE SOLVED: To provide an electronic component and a board that can suppress a reaction between Ni in a Ni-containing layer, which is a top layer of the electronic component or the board, and Bi in a Bi-based solder alloy to realize sure bonding when the electronic component is bonded with the board using the Pb free Bi-based solder alloy.

SOLUTION: In an electronic component or a board that is bonded using a Pb free Bi-based solder alloy containing 80 mass% or more Bi, a Zn metallized layer with a thickness of 0.05 to 8.00 μm or a Sn metallized layer with a thickness of 0.05 to 3.00 μm is formed on a Ni-containing layer which is a top layer of the electronic component or the board. Preferably, a second metallized layer of a metal selected from Ag, Au or Cu with a thickness of 0.05 to 1.00 μm is formed on the Zn metallized layer or the Sn metallized layer.

COPYRIGHT: (C)2012,JPO&INPIT