发明名称 ELECTRICAL DEVICE COOLING SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide an electrical device cooling system which can cool an electrical device without the need for a specifically-engineered device for circulating refrigerant. <P>SOLUTION: An electrical device cooling system 10 includes: a sealed housing 12 having a heat-releasing part 14 in an upper portion in the direction of gravity; multiple stages of element-mounting tables 18 to put elements 19 to be cooled, placed along a vertical direction in the sealed housing 12; electrically insulative refrigerant 20 sealed in the sealed housing 12; and a flow-channel barrier wall 16 provided in a meandering manner relative to the vertical direction between the multiple stages of element-mounting tables 18, and forming a circulation flow channel for the refrigerant to flow upward owing to convection resulting from heat generation by the element to be cooled, to be cooled by the heat-releasing part, and to go back downward. The refrigerant 20 is pressurized to a saturation vapor pressure or higher and sealed in the sealed housing 12. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011238722(A) 申请公布日期 2011.11.24
申请号 JP20100107919 申请日期 2010.05.10
申请人 TOYOTA MOTOR CORP 发明人 SUGITA MASAYUKI
分类号 H01L23/427;H05K7/20 主分类号 H01L23/427
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