| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structural adhesive suppressing lowering of physical properties, not causing increase of viscosity and specific gravity and applicable of electrodeposition coating on the cured surface thereof. <P>SOLUTION: This structural adhesive includes an epoxy resin and a latent curing agent as principal components, and contains at least a sorbate as a conductive agent, where the content of the sorbate is 0.1-30 pts.mass to 100 pts.mass of the epoxy resin. The adhesive suppresses lowering of physical properties to the minimum, bears electrodeposition coatability without causing increase of viscosity and specific gravity, maintains close adhesion with adherend members such as a substrate, and excels in corrosion resistance while providing electrodeposition coatability. <P>COPYRIGHT: (C)2012,JPO&INPIT |
