| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate and an electronic device for rigidly joining a resin material to a base material without leaving a large amount of processing liquids such as a plating liquid or the like to a hole of the base material. <P>SOLUTION: The base material 1 provided includes a part 1a for mounting an electronic component 4 provided to one principal surface, and a hole to be filled with a resin material opening to the one principal surface. In the hole 2, a segment 2a connecting the last positions of each depth is substantially continuous in the perspective side view along one direction B orthogonally crossing the depthwise direction D. Moreover, the segment 2a is formed of any one or both regions of the region substantially extending only in the depthwise direction D as the depth increases, and the region extends gradually or step by step toward the front side in one direction B as the depth increases. In addition, the hole 2 includes a ceiling region 2b where a part of the internal surface crosses the upper direction inverted from the depthwise direction D. <P>COPYRIGHT: (C)2008,JPO&INPIT |
