发明名称 METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR APPARATUS
摘要 Disclosed is a method of manufacturing a silicon carbide semiconductor apparatus which provides a smooth silicon carbide surface while maintaining a high impurity activation ratio. The method of manufacturing a silicon carbide semiconductor apparatus which forms an impurity region in the surface layer of a silicon carbide substrate includes the steps of implanting an impurity into the surface layer of the silicon carbide substrate, forming a carbon film on the surface of the silicon carbide substrate, preliminarily heating the silicon carbide substrate with the carbon film as a protective film, and thermally activating the silicon carbide substrate with the carbon film as a protective film.
申请公布号 US2011287618(A1) 申请公布日期 2011.11.24
申请号 US200913141275 申请日期 2009.11.09
申请人 SHOWA DENKO K.K. 发明人 SUZUKI KENJI
分类号 H01L21/22 主分类号 H01L21/22
代理机构 代理人
主权项
地址