| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating apparatus efficiently forming a plating layer having a uniform thickness on each base material particle having an electroconductive surface. <P>SOLUTION: The plating apparatus 10 includes a plating unit 1. The plating unit 1 has a base part 1y having a bottom surface 1p on which base material particles revolve while being in contact with the bottom surface 1p, and a plating chamber 1m capable of accommodating a particle group including the base material particles and a plating solution, which is formed by a direct or indirect connection with a body part 1x having a cylindrical circumferential wall surface 1q provided with an opening opposing to the bottom surface 1p of the base part 1y, and is constituted of the bottom surface 1p and the circumferential wall surface 1q by the connection. Further, the plating unit 1 has a supply pipe 1e which has a supply port opening at an upper part of the bottom surface 1p of the plating chamber 1m and supplies the plating solution from the supply port so that the plating solution may revolve along the circumferential wall surface of the plating chamber 1m, a discharge pipe 1c having a discharge port opening in the plating chamber 1m, a cathode which is brought into contact with base material particles being arranged on the bottom surface 1p of the plating chamber 1m, an anode arranged at a position immersed in the plating solution accommodated in the plating chamber 1m, and a power source connected to the cathode and the anode. <P>COPYRIGHT: (C)2012,JPO&INPIT |
