| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, capable of restricting an extension direction of a coil from inclining relative to a lamination direction of a component member without performing a flattening process to a surface of an insulating film. <P>SOLUTION: The method for manufacturing a semiconductor device comprises the steps of: preparing two support substrates 80 each having one flat surface; forming component members 30-60 on the flat surface of each of the support substrates 80; and forming a coil layer 21 including a coil 20, which comprises wiring portions 32-62 and connecting portions 32a, 32b-62a and 62b, inside the coil layer and having the support substrate 80 at both end portions in a lamination direction by performing a step including a step of bonding the component members 30-60 while applying pressure after arranging the component members arranged on the two support substrates 80 to face each other and connecting the wiring portions 32-62 of each of the component members 30-60 through the connecting portions 32a, 32b-62a and 62b while maintaining the flat surface of each of the support substrates 80 provided in the component members 30-60 parallel to each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
