发明名称 |
SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A semiconductor package includes a semiconductor chip having an upper surface, side surfaces connected with the upper surface, and bonding pads formed on the upper surface. A first insulation layer pattern is formed to cover the upper surface and the side surfaces of the semiconductor chip and expose the bonding pads. Re-distribution lines are placed on the first insulation layer pattern and include first re-distribution line parts and second re-distribution line parts. The first re-distribution line parts have an end connected with the bonding pads and correspond to the upper surface of the semiconductor chip and the second re-distribution line parts extend from the first re-distribution line parts beyond the side surfaces of the semiconductor chip. A second insulation layer pattern is formed over the semiconductor chip and exposes portions of the first re-distribution line parts and the second re-distribution line parts. |
申请公布号 |
US2011287584(A1) |
申请公布日期 |
2011.11.24 |
申请号 |
US201113197249 |
申请日期 |
2011.08.03 |
申请人 |
SUH MIN SUK;YANG SEUNG TAEK;LEE SEUNG HYUN;KIM JONG HOON;HYNIX SEMICONDUCTOR INC. |
发明人 |
SUH MIN SUK;YANG SEUNG TAEK;LEE SEUNG HYUN;KIM JONG HOON |
分类号 |
H01L21/78 |
主分类号 |
H01L21/78 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|