发明名称 |
A MICROELECTRONIC STRUCTURE INCLUDING A LOW K DIELECTRIC AND A METHOD OF CONTROLLING CARBON DISTRIBUTION IN THE STRUCTURE |
摘要 |
Embodiments of the present invention pertain to the formation of microelectronic structures. Low k dielectric materials need to exhibit a dielectric constant of less than about 2.6 for the next technology node of 32 nm. The present invention enables the formation of semiconductor devices which make use of such low k dielectric materials while providing an improved flexural and shear strength integrity of the microelectronic structure as a whole. |
申请公布号 |
WO2011106075(A3) |
申请公布日期 |
2011.11.24 |
申请号 |
WO2011US00215 |
申请日期 |
2011.02.03 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
XIE, BO;DEMOS, ALEXANDROS, T.;RAJ, DAEMIAN;NGO, SURE;YIM, KANG, SUB |
分类号 |
H01L21/3205;H01L21/205;H01L21/28 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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