| 摘要 |
PURPOSE: A curable resin composition is provided to prevent the degradation of diffusion reflectivity caused by time passage and thermal history and to obtain a solder resist layer including flexibility, low refractivity, adhesion with a substrate, and chemical resistance. CONSTITUTION: A curable resin composition comprises: a carboxylic group-containing copolymer resin; a quaternary alkyl phosphonium cation-containing compound represented by chemical formula (iv); an epoxy group-containing compound; and inorganic white pigment. The carboxylic group-containing copolymer resin is obtained by: reacting a compound represented by chemical formula (i) with a compound represented by chemical formula (ii); or reacting a compound represented by chemical formula (ii) with a compound represented by chemical formula (iii).
|
