发明名称 NEGATIVE RESIST MATERIAL, PATTERN FORMATION METHOD AND PHOTOMASK BLANK
摘要 <P>PROBLEM TO BE SOLVED: To provide a negative resist material, in particular a chemical amplitude negative resist material, which has a high contrast of alkali dissolution rate before and after light exposure, has a high resolution at high sensitivity and small line edge roughness and is especially suitable as a fine pattern forming material in manufacturing a super LSI or in manufacturing a photo mask pattern material and to provide a pattern formation method and a photomask blank using the negative resist material. <P>SOLUTION: A negative resist material includes a polymer compound having repeating units a expressed by the following formula (1) and a weight-average molecular weight of 1,000 to 500,000. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011237477(A) 申请公布日期 2011.11.24
申请号 JP20100106382 申请日期 2010.05.06
申请人 SHIN ETSU CHEM CO LTD 发明人 HATAKEYAMA JUN;WATANABE SATOSHI;MASUNAGA KEIICHI;DOMON DAISUKE
分类号 G03F7/038;C08F20/30;H01L21/027 主分类号 G03F7/038
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