FLAT TYPE GOLD-COATED COPPER RIBBON FOR HIGH TEMPERATURE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve ultrasonic bondability and high temperature reliability in a bonding ribbon which connects between a semiconductor device pad and a lead on the side of a nickel (Ni)-coated substrate simultaneously at a number of points.

SOLUTION: A gold-coated copper ribbon includes a copper core material and a gold coating layer. The copper core material is made of copper (Cu) having a purity of 99.9% or more which has a Vickers hardness of 70 Hv or less to impart conductivity and loop formability. The coating layer is made of gold (Au) having a purity of 99.9% or more having a fine granular crystal structure which is formed by magnetron sputtering of the gold (Au) in a rare gas atmosphere such as argon gas (Ar). Thus, the core material has the same Vickers hardness as the coating layer to prevent the damage of an aluminum pad and improve bondability. The gold fine crystal structure formed by magnetron sputtering in a rare gas atmosphere has a hardness higher than a gold (Au) bulk, and the granular structure suppresses heat broadening during bonding.

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