| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce internal voids in a solder joint part. <P>SOLUTION: An electronic circuit component mounting structure comprises: electrode lands 3 and 4 provided on the surface of a base material 2 of a circuit substrate; components 22 mounted on the circuit substrate; and a solder 5 electrically connecting the electrode lands 3 and 4 to a terminal 21 of the component 22. In the electronic circuit component mounting structure, ingredients are differentiated between the central area of the surface of the electrode land and the surrounding area of the central area. As a result, a difference in the rate of dissolution is caused between ingredients of the electrode lands 3 and 4 when the solder 5 is dissolved, and the stirring is promoted by the flow due to the diffusion of the ingredients of the electrode land 3 and 4 inside the solder 5 that went into a liquid state. <P>COPYRIGHT: (C)2012,JPO&INPIT |
