| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding film transfer device which has a simple structure, and also, can transfer a bonding film on the surface of an adherend, thereby, the adherend and other adherend are efficiently bonded together through the transferred bonding film, and to provide a bonding device which can efficiently bond the adherend, to which the bonding film has been transferred by the bonding film transfer device, and other adherend. <P>SOLUTION: The bonding film transfer sheet 1 includes: a base material; and the bonding film deposited on the base material; the bonding film being transferable to the first adherend 5. The bonding film transfer device 500 includes: a plasma processing mechanism (activation means) 520 to apply the plasma processing on the bonding film of the bonding film transfer sheet 1; a first adherend supply mechanism 530 to supply the first adherend 5 to the surface of the bonding film and bond the bonding film transfer sheet 1 and the first adherend 5 together to obtain a first temporary bonding body 7; a pressing mechanism 540 to press the first temporary bonding body 7; and a peeling mechanism 550 to peel the base material off the first temporary bonding body 7. <P>COPYRIGHT: (C)2012,JPO&INPIT |
