发明名称 EXCITATION ENERGY SPECIFICATION METHOD AND APPARATUS, AND BONDING METHOD AND APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an excitation energy specification method and apparatus for readily specifying the prime excitation energy of an energy line irradiated with a bonding film so as to control adhesion developing on the bonding film, and to provide a bonding film and apparatus for grasping individual differences for each bonding film and bonding members with the prime adhesion by specifying the prime excitation energy of the energy line irradiated with bonding film. <P>SOLUTION: The excitation energy specification apparatus 200 is for specifying the prime excitation energy for eliminating an elimination group 303 of a targeted amount in the bonding film 3 for developing the adhesion by eliminating the elimination group 303. The apparatus includes: a sample setting unit 11; a line source 12 for independently irradiating the bonding film 3 with the energy line different in the energy amount in terms of time; a measurement unit 13 for measuring the amount of the eliminated elimination group 303; and an analysis unit for specifying the prime excitation energy from the amount of the eliminated group measured for each energy amount. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011235556(A) 申请公布日期 2011.11.24
申请号 JP20100109659 申请日期 2010.05.11
申请人 SEIKO EPSON CORP 发明人 SATO MITSURU
分类号 B29C65/48 主分类号 B29C65/48
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