| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing excellent in the balance of soldering resistance, burning resistance, and continuous moldability, and to provide an electronic part device excellent in reliability which comprises carrying out sealing of the element by the cured product. <P>SOLUTION: The resin composition for sealing includes: an epoxy resin (A) consisting of one or more polymers having a structure shown by general formula (1) and containing a polymer which is different from (d-1)/c=1 in the General formula (1); a phenol resin based curing agent (B); and an inorganic filler (C). <P>COPYRIGHT: (C)2012,JPO&INPIT |
