| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminated ceramic electronic component allowing a compact film of an external electrode to be formed while suppressing generation of blister (air bubble) caused by residual carbon inside the external electrode in a step of baking a laminated body applied with conductive paste for external electrode thereon. <P>SOLUTION: The manufacturing method for a laminated ceramic electronic component, in accordance with the present invention, comprises the step of baking the laminated body applied with the conductive paste for external electrode thereon. In the aforementioned step, pressure is increased from atmospheric pressure to 0.15 MPa while baking is performed to remove binder resin in the conductive paste for external electrode. Consequently, binder resin is more removed and residual carbon can be more reduced, so that blister (air bubble) caused by residual carbon can be suppressed and a compact film for the external electrode can be formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
