发明名称 MECHANICAL ISOLATION FOR MEMS ELECTRICAL CONTACTS
摘要 In accordance with the disclosure, a MEMS substrate is provided that includes: a central planar portion configured to support a MEMS device; and a first electrical pad coplanar with the central planar portion, the first pad being connected to the central planar portion through a first flexure, wherein the first flexure is configured to substantially mechanically isolate the first electrical pad from the central planar portion.
申请公布号 WO2010138931(A3) 申请公布日期 2011.11.24
申请号 WO2010US36749 申请日期 2010.05.28
申请人 TESSERA MEMS TECHNOLOGIES, INC.;GUTIERREZ, ROMAN C.;CALVET, ROBERT J 发明人 GUTIERREZ, ROMAN C.;CALVET, ROBERT J
分类号 B81B7/00 主分类号 B81B7/00
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