SEMICONDUCTOR CHIP AND PROCESS FOR PRODUCTION THEREOF

摘要

Disclosed is a semiconductor chip which is a semiconductor device involving a hexagonal semiconductor layer that has the anisotropy of mechanical properties. The semiconductor chip (21) has a quadrilateral shape having a first side (1A) and a second side (1B) that is normal to the first side (1A) when observed from the direction perpendicular to the semiconductor chip (21), wherein the amount of thermal deformation of the semiconductor chip (21) in the direction along which the first side (1A) extends and that in the direction along which the second side (1B) extends are substantially the same as each other.