发明名称 LIGHT EMITTING DEVICE, METHOD FOR FABRICATING THE LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE
摘要 PURPOSE: A light emitting device, a method for fabricating the light emitting device and a light emitting device package are provided to suppress the difference between lattice mismatch and thermal expansion by growing a buffer layer in a nitride semiconductor and a substrate. CONSTITUTION: In a light emitting device, a method for fabricating the light emitting device and a light emitting device package, a light emitting structure is formed on a substrate. The light emitting structure comprises a first electrical conduction semiconductor layer(120), an active layer(130) and a second electrical conduction semiconductor layer(140). A nitride semiconductor layer(170) is formed on the first and second electrical conduction semiconductor layer. A nitride semiconductor layer comprises an opening. A first electrode pad(180) is formed on the light emitting structure.
申请公布号 KR20110126793(A) 申请公布日期 2011.11.24
申请号 KR20100046249 申请日期 2010.05.18
申请人 LG INNOTEK CO., LTD. 发明人 JEONG, HWAN HEE
分类号 H01L33/36;H01L33/20 主分类号 H01L33/36
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