| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device, a wiring board, and an electronic device manufacturing method, which are arranged so that an electronic part is surface-mounted on a wiring board and which enable the enhancement of the reliability of connection between electrodes of the electronic part and lands on the wiring board. <P>SOLUTION: An electronic device includes: a wiring board with lands formed on one face thereof; an electronic part having electrodes for external connection which are formed corresponding to the lands; and a solder connection portion connecting between the land and the electrode. The electronic part is surface-mounted on the wiring board. The wiring board has a through-hole which opens at one end in the one face where the land is located and opens at the other end in a rear face opposite to the one face, and which has a wall-face conductor portion formed on its wall face. The lands include a land having a hole which the one end of the through-hole opens into, and connected with the wall-face conductor portion. The solder connection portion connecting between the land having the hole and the electrode is integrally formed with an in-hole solder connection portion disposed inside the through-hole and connected with the wall-face conductor portion. <P>COPYRIGHT: (C)2012,JPO&INPIT |
