| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce thermal stress based on the difference of thermal coefficient of expansion between a heat spreader and a heat exchanger in a power semiconductor module to which the head spreader and heat exchanger are bonded. <P>SOLUTION: A heat spreader 11 is composed of a single material of Cu and a heat exchanger 30 is composed of a composite material of Al and Fe. Consequently, the linear expansion coefficient of one material (Al) constituting the composite material is larger than that of the single material (Cu), and the linear expansion coefficient of the other material (Fe) constituting the composite material is smaller than that of the single material (Cu). Since one material (Al) of the composite material is more prone to stretch than the single material (Cu) while the other material (Fe) is less prone to stretch than the single material (Cu), stretch of one material (Al) of the composite material is regulated by the other material (Fe) of the composite material. Consequently, generation of thermal stress based on the difference of thermal coefficient of expansion between the heat spreader 11 and the heat exchanger 30 can be reduced. <P>COPYRIGHT: (C)2012,JPO&INPIT |
