发明名称 PLACEMENT PLATE, SUBSTRATE TRANSFER APPARATUS, SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a placement plate, a substrate transfer apparatus, and a substrate processing apparatus which makes sure that a substrate can be taken out of a substrate storage container. <P>SOLUTION: A tweezer 50 for putting a wafer 1 into and out of a pod comprises: base end side placement parts 52, 52 for placing the wafer 1; tip side placement parts 54, 54; tip side hook parts 55, 55 for hooking the peripheral part of the wafer 1 on the back side inside the pod when taking the wafer 1 out of the pod; and a counterbore 51 for preventing displacement of the wafer 1. The tip side hook parts 55, 55 are positioned with the tip sides forked, their included angles &Theta;b to the placement planes of the tip side placement parts 54, 54 are right or acute, and they are positioned near positioning parts inside the pod when hooking the wafer 1. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011238962(A) 申请公布日期 2011.11.24
申请号 JP20110165330 申请日期 2011.07.28
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MORIKAWA HARUO;YANAGAWA HIDEHIRO;KIMURA KAZUHIRO;YAMADA KIYOAKI
分类号 H01L21/677;B65G49/06;B65G49/07 主分类号 H01L21/677
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