Enhanced modularity in heterogeneous three-dimensional computer processing chip stacks includes a method of manufacture. The method includes preparing a host layer and integrating the host layer with at least one other layer in the stack. The host layer is prepared by forming cavities on the host layer for receiving chips pre-configured with heterogeneous properties relative to each other, disposing the chips in corresponding cavities on the host layer, and joining the chips to respective surfaces of the cavities thereby forming an element having a smooth surface with respect to the host layer and the chips.
申请公布号
WO2011146211(A1)
申请公布日期
2011.11.24
申请号
WO2011US34097
申请日期
2011.04.27
申请人
INTERNATIONAL BUSINESS MACHINES CORP.;EMMA, PHILIP, G.;KURSUN, EREN;RIVERS, JUDE, A.