SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCTION THEREOF

摘要

A first semiconductor substrate (101) and a second semiconductor substrate (111) are bound to each other through an adhesive agent (107A). The first semiconductor substrate (101) is equipped with a first electrode (104) of which at least an end part is exposed, and the second semiconductor substrate (111) is equipped with a second electrode (114) of which at least an end part is exposed. The adhesive agent (107A) contains carbon nanotubes and is applied onto an area excluding a connection part between the first electrode (104) and the second electrode (114) and an area adjacent to the connection part.