| 摘要 |
The vacuum deposition method comprises heating a coating material in form of a vapor cloud (2) in a evaporation source (1) until it vaporizes and evaporates, and spreading the evaporated coating material on the growing up substrate surface (3) in a straight line, where no heat radiation from the evaporation source reaches the substrate surface. Two panels (4.1, 4.2) are arranged at a spatial distance between the evaporation source and the substrate surface, where the panels controls direct rays that pass from the evaporation source to the substrate surface. The vacuum deposition method comprises heating a coating material in form of a vapor cloud (2) in a evaporation source (1) until it vaporizes and evaporates, and spreading the evaporated coating material on the growing up substrate surface (3) in a straight line, where particles with a defined velocity interval are selected from every part of the vapor cloud, so that only particles with defined velocity are transmitted to the substrate surface and no heat radiation from the evaporation source reaches the substrate surface. Two panels (4.1, 4.2) are arranged at a spatial distance between the evaporation source and the substrate surface, where the panels controls direct rays that pass from the evaporation source to the substrate surface. The temperature of the substrate surface is set by an independent supply of heat or cooling to a desired value due to the thermal decoupling of evaporation source and substrate surface. The impact energy of the coating material is adjusted at the substrate surface. The coating material from the existing vapor cloud is divided into partial clouds of steam directly behind the evaporation source. An independent claim is included for an apparatus for depositing thin films on substrates by vacuum deposition method.
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