| 发明名称 |
LEAD-FREE SOLDER COMPOSITION FOR VEHICLE |
| 摘要 |
<p>Disclosed is a lead-free solder composition for a vehicle, which is characterized by being composed of 26-56% by mass of In, 0-10% by mass of Ag and the balance, namely 34-74% by mass of Sn. The composition is useful as a solder composition for a feeding terminal, said solder composition being used for the purpose of forming a contact with glass for a vehicle.</p> |
| 申请公布号 |
WO2011145591(A1) |
申请公布日期 |
2011.11.24 |
| 申请号 |
WO2011JP61261 |
申请日期 |
2011.05.17 |
| 申请人 |
CENTRAL GLASS COMPANY, LIMITED;NISHI, MIZUKI;OGAWA, TAKAYUKI |
发明人 |
NISHI, MIZUKI;OGAWA, TAKAYUKI |
| 分类号 |
B23K35/26;C22C13/00;C22C28/00 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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