| 摘要 |
An object of the present invention is to prevent the damage of molding pins in an injection-molding die and to provide a secure deposit, thereby reducing circuit pitches to the limit. Pre-determined circuit patterns (3) of a conductive material are formed on both sides of a circuit board (2). A through hole (5) is formed on the circuit board (2) to carry electricity between the circuit patterns (3) on the both sides thereof. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns (3) and wide in a circuit extending direction. |
