According to an example embodiment a method of plating resin using a graphene thin layer includes forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on the resin substrate.
申请公布号
EP2388355(A1)
申请公布日期
2011.11.23
申请号
EP20110161501
申请日期
2011.04.07
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
BAE, AH HYUN;SON, SANG IK;NAM, JAE DO;LEE, JUN HO;HWANG, TAE SEON;OH, JOON SUK