| 摘要 |
<p>A first flexible base material (131) formed with polyimide or the like and having conductive patterns (132, 133) and a second flexible base material (101) formed with polyethylene or the like are disposed in a horizontal direction. The first and second flexible base materials are covered with insulation layers (112, 113) in such a way that at least part of the first flexible base material is exposed. Vias (116, 141) are formed in the insulation layers (112, 113) that reach the conductive patterns (132, 133) of first flexible base material (131). Wirings (117, 142) are formed by plating that reach the conductive patterns (132, 133) through the vias (116, 141). Upper-layer insulation layers (114, 115, 144, 145) are laminated on the insulation layers (112, 113), circuits (123, 150) are formed, and wirings (117, 142) are connected.</p> |
