发明名称 NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS
摘要 <p>Semiconductor coating compositions useful as aperture fill compositions and bottom antireflective coatings containing: (1) a nonpolymeric, binder (NPB) represented by formula (Ao), where Q is a multivalent organic nucleus, Z1 and Z11 are divalent linking groups, W is a divalent organic bridging group, theta is an organic DUV chromophore-containing substituent T or an organic substituent schwa having little or no absorbance to DUV light, X is a reactive functional group, Y11 is a reactive functional group, a ranges from about 2 to15, b ranges from about zero to 10, c ranges from about zero to 5, and d is zero or 1, wherein Q, W, and theta together contain at least two groups or sites which are reactive in a crosslinking reaction and with the proviso that the sum of (a+b+c) is greater than or equal to 3. (2) a crosslinking agent; and (3) a solvent.</p>
申请公布号 EP2387735(A1) 申请公布日期 2011.11.23
申请号 EP20100732115 申请日期 2010.01.15
申请人 FUJIFILM ELECTRONIC MATERIALS USA, INC. 发明人 MALIK, SANJAY;DILOCKER, STEPHANIE, J.;REINERTH, WILLIAM, A.;SAKAMURI, RAJ
分类号 G03F7/00 主分类号 G03F7/00
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