发明名称 LED PACKAGE MANUFACTURING METHOD
摘要 PURPOSE: An LED package production method is provided to easily control colors by forming a cut-off groove on a light-emitting layer and spreading a fluorescent substance in the side of the light-emitting layer. CONSTITUTION: A substrate equipped with a base material layer(110) and a light-emitting layer(120) is provided. A plurality of discrete light-emitting layers is formed by forming a cut-off groove(140) having a constant pattern in the light-emitting layer. A fluorescent substance(130) is coated in the external side of a discrete light-emitting layer. A plurality of LED packages is individually separated by cutting the cut-off groove. The thickness(t3) of the fluorescent substance which is coated in the top of the light-emitting layer and the thickness(t2) of the fluorescent substance which is coated on the side of the light-emitting layer are same.
申请公布号 KR20110125990(A) 申请公布日期 2011.11.22
申请号 KR20100045661 申请日期 2010.05.14
申请人 HANA MICRON CO., LTD. 发明人 PARK, JOO HOON
分类号 H01L33/48;H01L33/50 主分类号 H01L33/48
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