发明名称 COOLING PLATE STRUCTURE FOR LED
摘要 PURPOSE: A heat sink structure for an LED is provided to maximize the heat transmission of an LED by forming a plurality of cooling fins in a heat pipe, which is arranged in a light-emitting diode module, at a circumferential direction. CONSTITUTION: A heat pipe(70) is arranged in a light emitting diode module(10). A supporting member(80) is included in the heat pipe. A plurality of LEDs(30) is electrically connected to a metal PCB substrate(20). A fixing member(40) is included to protect the plurality of the LEDs on the metal PCB substrate. A sub-layer(50) is filled in the fixing member.
申请公布号 KR20110125761(A) 申请公布日期 2011.11.22
申请号 KR20100045299 申请日期 2010.05.14
申请人 IQUE DIGITAL CO., LTD.;PARK, JUN HEE;LEE, MYUNG KOO 发明人 LEE, MYUNG KOO;PARK, JUN HEE
分类号 F21V29/00 主分类号 F21V29/00
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