发明名称 Glass package that is hermetically sealed with a frit and method of fabrication
摘要 A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.
申请公布号 US8063560(B2) 申请公布日期 2011.11.22
申请号 US20060521888 申请日期 2006.09.15
申请人 AITKEN BRUCE G.;CARBERRY JOEL P.;DEMARTINO STEVEN E.;HAGY HENRY E.;LAMBERSON LISA A.;MILLER, II RICHARD J.;MORENA ROBERT;SCHROEDER, III JOSEPH F.;STRELTSOV ALEXANDER;WIDJAJA SUJANTO;CORNING INCORPORATED 发明人 AITKEN BRUCE G.;CARBERRY JOEL P.;DEMARTINO STEVEN E.;HAGY HENRY E.;LAMBERSON LISA A.;MILLER, II RICHARD J.;MORENA ROBERT;SCHROEDER, III JOSEPH F.;STRELTSOV ALEXANDER;WIDJAJA SUJANTO
分类号 H05B33/00;C03C3/072;C03C3/17;C03C3/19;C03C3/21;C03C8/24;C03C27/00;C03C27/06;H01L51/52 主分类号 H05B33/00
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