发明名称 Wafer supporting device of a sputtering apparatus
摘要 A wafer supporting device of a sputter apparatus includes a pedestal positioned in a sputtering chamber and used to load a wafer for sputtering, a deposition ring having a recess positioned on a peripheral portion of the pedestal, and a cover ring positioned on the pedestal and the deposition ring. The cover ring has a gate corresponding to the recess.
申请公布号 US8062487(B2) 申请公布日期 2011.11.22
申请号 US20070768192 申请日期 2007.06.25
申请人 CHENG CHI-PIAO;LIANG LI-CHUN;HUANG YU-JEN;CHEN BEEN;TING SHENG-YIH;UNITED MICROELECTRONICS CORP. 发明人 CHENG CHI-PIAO;LIANG LI-CHUN;HUANG YU-JEN;CHEN BEEN;TING SHENG-YIH
分类号 C25B9/00;C23C14/00;C23C16/00;C23C16/50;C25B11/00;C25B13/00 主分类号 C25B9/00
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