发明名称 |
Wafer supporting device of a sputtering apparatus |
摘要 |
A wafer supporting device of a sputter apparatus includes a pedestal positioned in a sputtering chamber and used to load a wafer for sputtering, a deposition ring having a recess positioned on a peripheral portion of the pedestal, and a cover ring positioned on the pedestal and the deposition ring. The cover ring has a gate corresponding to the recess. |
申请公布号 |
US8062487(B2) |
申请公布日期 |
2011.11.22 |
申请号 |
US20070768192 |
申请日期 |
2007.06.25 |
申请人 |
CHENG CHI-PIAO;LIANG LI-CHUN;HUANG YU-JEN;CHEN BEEN;TING SHENG-YIH;UNITED MICROELECTRONICS CORP. |
发明人 |
CHENG CHI-PIAO;LIANG LI-CHUN;HUANG YU-JEN;CHEN BEEN;TING SHENG-YIH |
分类号 |
C25B9/00;C23C14/00;C23C16/00;C23C16/50;C25B11/00;C25B13/00 |
主分类号 |
C25B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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