| 摘要 |
<p>PURPOSE: An LED package production method is provided to multiply photonic efficiency which accomplishes white light by uniformly diffusing a fluorescent material capable of changing the wavelength of light which is generated in a light emitting chip to the specific location. CONSTITUTION: A package body(110) is shaped by resin in order to form a cavity having an inner protrusion. A light emitting diode(130) which is loaded on a metal plate(120) and a lead terminal of the metal plate are wire-bonded by the medium of a conductive wire(140). A lower resin part(151) is formed by filling transparent resin to the inner protrusion. A fluorescent layer(152) of constant thickness is formed on the upper side of the lower resin part. An upper resin part is formed by filling the transparent resin to the upper side of the package body in order to cover the fluorescent layer.</p> |
