| 发明名称 |
Heat spreader as mechanical reinforcement for ultra-thin die |
| 摘要 |
A technique to fabricate a package. A thin wafer supported by a wafer support substrate (WSS) is formed. The WSS-supported thin wafer layer is diced into a plurality of WSS-supported thin dice. A WSS-supported thin die is bonded to a first heat spreader (HS) to form a HS-reinforced thin die.
|
| 申请公布号 |
US8063482(B2) |
申请公布日期 |
2011.11.22 |
| 申请号 |
US20060479403 |
申请日期 |
2006.06.30 |
| 申请人 |
LU DAOQIANG;INTEL CORPORATION |
发明人 |
LU DAOQIANG |
| 分类号 |
H01L23/02;H01L21/00;H01L23/48 |
主分类号 |
H01L23/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
