Circuit board, method for manufacturing the same, and semiconductor device

摘要

A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.