发明名称 |
Semiconductor device including semiconductor constituent |
摘要 |
A semiconductor device includes a semiconductor constituent having a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate. An under-layer insulating film is provided under and around the semiconductor constituent. A plurality of under-layer wires are provided under the under-layer insulating film and electrically connected to the electrodes for external connection of the semiconductor constituent. An insulating layer is provided around the semiconductor constituent and on the under-layer insulating film. A frame-like insulating substrate is embedded in an upper surface of the insulating layer and positioned around the semiconductor constituent. A plurality of upper-layer wires are provided on the insulating substrate. A base plate on which the semiconductor constituent and the insulating layer are mounted is removed.
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申请公布号 |
US8063490(B2) |
申请公布日期 |
2011.11.22 |
申请号 |
US20100729608 |
申请日期 |
2010.03.23 |
申请人 |
JOBETTO HIROYASU;CASIO COMPUTER CO., LTD. |
发明人 |
JOBETTO HIROYASU |
分类号 |
H01L21/469 |
主分类号 |
H01L21/469 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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