发明名称 Method of correcting a mask pattern and method of manufacturing a semiconductor device
摘要 The method of manufacturing a semiconductor device has deciding an amount of a correction of a mask pattern for a size of an active region of a semiconductor substrate, correcting the mask pattern on the basis of the decided amount of the correction, and exposing a resist film by using an exposure mask having the corrected mask pattern.
申请公布号 US8062810(B2) 申请公布日期 2011.11.22
申请号 US20080052965 申请日期 2008.03.21
申请人 MASANORI TERAHARA;FUJITSU SEMICONDUCTOR LIMITED 发明人 MASANORI TERAHARA
分类号 G03F1/36;G03F1/68;G03F1/70;G03F7/00;H01L21/027;H01L21/82;H01L21/822;H01L27/04 主分类号 G03F1/36
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