| 摘要 |
PURPOSE: A semiconductor chip package substrate and a method for manufacturing the same are provided to be matched with the solder resist layers of the upper unit type package area of the substrate by forming a lower solder resist layer in the lower unit type package area of the substrate. CONSTITUTION: A unit type package area includes an upper unit type package area(A) and a lower unit type package area(B). A circuit layer(20) includes an upper circuit layer(21) and a lower circuit layer(22). An upper sawing area(SA) is formed between spaces in the upper unit type package area. A lower sawing area(SB) includes a dam shaped solder resist layer(40). The solder resist layer is eliminated in the final separation process of a semiconductor package. |
