发明名称 |
THERMALLY CONDUCTIVE FOAM PRODUCT. |
摘要 |
<p>A compressible, thermally conductive foam interface pad is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. An assembly including the foam interface pad and the opposed electronic components is also provided.</p> |
申请公布号 |
MX2011008921(A) |
申请公布日期 |
2011.11.18 |
申请号 |
MX20110008921 |
申请日期 |
2010.05.05 |
申请人 |
PARKER HANNIFIN CORPORATION |
发明人 |
JONATHAN BERGIN;VICTORIA SANTA FE;CHRISTOPHER SEVERANCE;GARY ROSA |
分类号 |
H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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