SEMICONDUCTOR PACKAGE CAPABLE OF COST REDUCTION AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to reduce manufacturing processes by omitting an additional plating process by forming a solder land on the first surface of a lead frame before the semiconductor chip is mounted. CONSTITUTION: A lead frame(100) for a semiconductor package includes a lead(106) and a chip mounting unit(104). A solder land(142,144) is smaller than the pattern width of the lead frame. A semiconductor chip(200) is mounted on the chip mount unit of the second surface(100b) of the lead frame. The semiconductor chip is connected to the lead of the lead frame by an Au wire(230). An encapsulant(240) encapsulates the second surface of the lead frame, the semiconductor chip, and the Au wire.