SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed is a high-yield semiconductor device which can prevent a dicing blade from excessively breaking. The semiconductor device (10) is provided with: a semiconductor element (11); a light receiving section (12), which is provided on the front surface of the semiconductor element (11); a first resin layer (15), which is provided in a region smaller than the front surface of the semiconductor element (11), said region being on the front surface of the semiconductor element (11), such that the light receiving section (12) is covered with the first resin layer; and a second resin layer (16), which is provided on the front surface of the semiconductor element (11) such that the side surface of the first resin layer (15) is covered with the second resin layer.