| 摘要 |
A system and method of repairing electrical circuits including employing a laser and at least one laser beam delivery pathway for laser pre-treatment of at least one conductor repair area of a conductor formed on a circuit substrate and employing the laser and at least part of the at least one laser beam delivery pathway for application of at least one laser beam to a donor substrate in a manner which causes at least one portion of the donor substrate to be detached therefrom and to be transferred to at least one predetermined conductor location. |
