发明名称 |
SPUTTERING TARGET FOR FORMING WIRING FILM OF FLAT PANEL DISPLAY |
摘要 |
A copper alloy wiring film of a flat panel display of the present invention and a sputtering target for forming the same have a composition including Mg: 0.1 to 5 atom %; either one or both of Mn and Al: 0.1 to 11 atom % in total; and Cu and inevitable impurities as the balance, and if necessary, may be further including P: 0.001 to 0.1 atom %.
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申请公布号 |
US2011281134(A1) |
申请公布日期 |
2011.11.17 |
申请号 |
US20090737550 |
申请日期 |
2009.07.31 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
MAKI KAZUNARI;YAGUCHI KENICHI;NAKASATO YOSUKE;ASAO HARUHIKO |
分类号 |
B32B15/01;C23C14/34 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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