发明名称 SPUTTERING TARGET FOR FORMING WIRING FILM OF FLAT PANEL DISPLAY
摘要 A copper alloy wiring film of a flat panel display of the present invention and a sputtering target for forming the same have a composition including Mg: 0.1 to 5 atom %; either one or both of Mn and Al: 0.1 to 11 atom % in total; and Cu and inevitable impurities as the balance, and if necessary, may be further including P: 0.001 to 0.1 atom %.
申请公布号 US2011281134(A1) 申请公布日期 2011.11.17
申请号 US20090737550 申请日期 2009.07.31
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 MAKI KAZUNARI;YAGUCHI KENICHI;NAKASATO YOSUKE;ASAO HARUHIKO
分类号 B32B15/01;C23C14/34 主分类号 B32B15/01
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